Date & Time
Starts
Jun 23, 2026 5:00pm CEST
Ends
5:30pm CEST
Location
Online
Language
English
As electronics continue to evolve, printed circuit boards (PCB) are under increasing pressure to perform reliably in demanding and critical applications. Higher network speeds, artificial intelligence (AI), high-density computing and always-on systems are pushing complex PCB designs, materials and interconnections beyond traditional limits, which leaves little tolerance for early failures.
In this webinar, UL Solutions experts will explain why PCB reliability has become critical and how we can help end product manufacturers in assessing the reliability of their selected PCBs that aid in the proper selection based on third party test results.
The session will explore how emerging applications such as aerospace, medical devices, automotive systems, data centers, cloud and edge computing, and smart manufacturing are driving the need for stricter reliability testing.
Attendees will gain insight into the common challenges manufacturers face when sourcing PCBs, including design validation, supplychain variability and supplier-to-supplier consistency.
The webinar will show how reliability testing at both the design and batch level can reduce risk, improve confidence and support informed decision‑making.
The session will introduce the most widely used PCB reliability and functionality tests, including:
- Interconnect Stress Test (IST)
- Accelerated Thermal Cycling (ATC)
- Conductive Anodic Filament (CAF) testing
- Failure analysis and microsectioning
We look forward to seeing you at the webinar.
Speakers
Jakub Kacki, business development manager, Consumer, Medical & Information Technologies, UL Solutions
John Marke, program manager, Consumer, Medical & Information Technologies, UL Solutions
Polly Siu, lead project engineer, Consumer, Medical & Information Technologies, UL Solutions
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