Liquid-cooling technologies are critical for supporting the burgeoning data center market. By 2030, the direct-to-chip liquid cooling market is expected to exceed $5.6 billion (USD), with a compound annual growth rate of 19.7%.1
Gasket materials are an essential part of liquid-cooling systems, providing protection from contaminants at enclosure joints and connection points. These components, including O-rings and seals, need to support reliability and performance of the cooling system.