As data centers continue to scale for AI, cloud computing and high-performance networking, new optical architectures such as External Laser Small Form Factor Pluggable (ELSFP) and Co-packaged Optics (CPO) architectures are being introduced to support next-generation system designs. ELSFP-based CPO architectures fundamentally restructure how optical signals are generated and delivered within data center equipment, introducing new considerations for laser safety compliance.
While this article focuses on ELSFP-based CPO architectures as a representative and increasingly standardized example of external laser integration, it is important to recognize that multiple approaches are being explored for CPO system architectures. Current implementations most commonly utilize external laser source approaches, such as ELSFP, in which the laser radiation is provided from a separate pluggable module. In addition to these external laser source implementations, alternative designs are being developed in which the laser is more closely integrated with the optical engine. While these approaches differ in system design, maturity and implementation, the laser safety principles discussed in this article are broadly applicable, particularly the distinction between component-level emission characteristics and system-level accessible radiation.