September 30, 2026
Key Points
- UL Solutions has launched a certification program for direct-to-chip liquid cooling equipment used in AI data centers.
- The program uses UL 4501 to evaluate eligible liquid cooling subassemblies for safety, performance, leak integrity and interoperability.
- Certification can help manufacturers demonstrate product readiness.
The computer chips that drive artificial intelligence (AI) can generate intense heat. If that heat is not removed effectively, computing equipment can slow down, shut down or become damaged. Traditional air cooling may not be enough for today’s most powerful computing systems. With direct-to-chip liquid cooling, coolant flows through a cold plate attached to the chip, absorbing heat and carrying it away.
UL Solutions has launched a certification program for eligible parts and subassemblies used in direct-to-chip liquid cooling systems. The program evaluates eligible liquid cooling subassemblies for safety, performance, leak integrity and interoperability.
The certification program covers eligible liquid-filled parts and subassemblies that move coolant through information and communication technology equipment.
Eligible equipment can include cold plates, which absorb heat directly from computer chips; manifolds, which send coolant to servers and equipment racks; and quick disconnects, which allow equipment to be serviced without draining the full cooling system.
Liquid cooling can help data centers manage heat from AI and other types of high-density computing. However, leaks, corrosion, contamination or incompatible parts can affect system safety, performance and reliability.
Connecting parts from multiple suppliers can also present challenges. Parts may fit together physically but require different coolants, pressure levels or operating conditions.
Independent certification demonstrates that an eligible product meets applicable requirements. This can help manufacturers demonstrate product readiness and support their product claims.
For data center customers, certification can help inform purchasing and integration decisions. Evaluating eligible parts before they are added to a complete cooling system can also help identify problems earlier and reduce the need for repeated testing.
UL Solutions uses UL 4501, the Outline of Investigation for Safety, Performance and Interoperability of Liquid-Filled Components and Assemblies Used in Liquid Cooling Systems, to evaluate eligible liquid cooling subassemblies. This evaluation covers durability, liquid flow, coolant compatibility, pressure and leak integrity, interoperability, production controls and installation requirements.
Additional information about the certification program is available in the Sept. 29 press release.
More details about UL Solutions’ services for data center development and operations are available on the Data Center Ecosystem page at UL.com.